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對電信(xin)、數據、工業、儀(yi)器和醫療設(she)備(bei)功用日益添(tian)加(jia)的需求正推進著連(lian)接(jie)器規劃朝(chao)更小(xiao)(xiao)空間(jian)、更多(duo)電源信號(hao)的方向開(kai)展。線性電流(liu)密度的最大化意味著功率(lv)更大，連接器的占位(wei)空間(jian)更小(xiao)(xiao)，功用(yong)先進。這些特色是上(shang)述細(xi)分市場體系總體規劃的快速改變和不斷添加的需(xu)求所帶來的結果。
更小更便攜的(de)終端產品
設備(bei)的(de)(de)外形(xing)在不(bu)斷地依照(zhao)既(ji)定的(de)(de)規(gui)矩變(bian)得(de)(de)越來越精約，終端(duan)產(chan)品(pin)(pin)則變(bian)得(de)(de)愈加(jia)(jia)(jia)細巧。部(bu)(bu)件(jian)(jian)生(sheng)(sheng)產(chan)商需求規(gui)劃出愈加(jia)(jia)(jia)緊(jin)湊(cou)細巧的(de)(de)封裝。但(dan)是，因為處理器(qi)、存儲器(qi)以(yi)及(ji)其他(ta)集(ji)成(cheng)電路的(de)(de)數量在體(ti)系內不(bu)斷添加(jia)(jia)(jia)，發生(sheng)(sheng)了更多的(de)(de)熱量，使得(de)(de)熱辦(ban)理在體(ti)系規(gui)劃中(zhong)變(bian)得(de)(de)非常(chang)重要。關于電源連接器(qi)生(sheng)(sheng)產(chan)商來說(shuo)，這(zhe)些要素帶來了許多獨一無二的(de)(de)應戰(zhan)。今天(tian)，咱(zan)們的(de)(de)方(fang)針是在滿意不(bu)斷添加(jia)(jia)(jia)的(de)(de)電源要求的(de)(de)一起供給愈加(jia)(jia)(jia)細巧的(de)(de)封裝。具(ju)有(you)更小高度(du)和寬(kuan)度(du)的(de)(de)部(bu)(bu)件(jian)(jian)不(bu)光(guang)可認為放(fang)置其他(ta)附加(jia)(jia)(jia)部(bu)(bu)件(jian)(jian)供給更多空間(jian)，還能(neng)夠帶來更佳的(de)(de)氣流。例如，用密布(bu)刀片式效(xiao)勞器(qi)代替數據(ju)中(zhong)心內機架式效(xiao)勞器(qi)，顯現(xian)了產(chan)品(pin)(pin)朝(chao)著更小尺度(du)開展的(de)(de)行業(ye)趨勢(shi)。運轉這(zhe)些愈加(jia)(jia)(jia)緊(jin)湊(cou)的(de)(de)體(ti)系需求更高的(de)(de)電源密度(du)和信號(hao)密度(du)。
HCI連接器
電源連接器生廠商需求(qiu)要點考慮電流密(mi)度、剖面高(gao)度和寬(kuan)度以及氣流，因為當處理器(qi)變得愈加高(gao)效且耗費更少電源時，單個(ge)體系內處理器(qi)數量的(de)添(tian)加會導致在用(yong)電量方(fang)面發生一個(ge)凈增(zeng)額。此外，更高(gao)的(de)機架(jia)密(mi)度和更高(gao)瓦數的(de)電能供應要求(qiu)具(ju)有更高(gao)電源密(mi)度的(de)連接器(qi)解決方(fang)案。
高電流運用(yong)
連接器生廠商(shang)在規范(fan)、高(gao)(gao)效、低成(cheng)(cheng)本的(de)(de)(de)沖壓成(cheng)(cheng)型電(dian)源(yuan)(yuan)(yuan)觸點(dian)基座上裝置具有高(gao)(gao)電(dian)源(yuan)(yuan)(yuan)密(mi)度(du)的(de)(de)(de)電(dian)源(yuan)(yuan)(yuan)連接器。沖壓成(cheng)(cheng)型技能使(shi)(shi)得獲(huo)取高(gao)(gao)電(dian)源(yuan)(yuan)(yuan)密(mi)度(du)成(cheng)(cheng)為(wei)可能。在高(gao)(gao)電(dian)流運(yun)用(yong)中，這種高(gao)(gao)效低成(cheng)(cheng)本的(de)(de)(de)技能能夠(gou)代替貴(gui)重(zhong)的(de)(de)(de)螺絲(si)機床觸點(dian)。而(er)高(gao)(gao)傳(chuan)導性銅合金(jin)的(de)(de)(de)摻入(ru)、優化的(de)(de)(de)電(dian)源(yuan)(yuan)(yuan)觸點(dian)規劃(hua)以(yi)及通(tong)風外(wai)殼提升(sheng)了(le)設備功用(yong)，使(shi)(shi)其符兼并超過現在高(gao)(gao)電(dian)流運(yun)用(yong)的(de)(de)(de)要求。
例(li)如，一家連(lian)接(jie)器(qi)(qi)供應(ying)商規(gui)劃出一種(zhong)新式電(dian)(dian)(dian)(dian)(dian)(dian)(dian)源(yuan)連(lian)接(jie)器(qi)(qi)體系(xi)(xi)，這種(zhong)體系(xi)(xi)包括現有(you)SSI連(lian)接(jie)器(qi)(qi)[工業電(dian)(dian)(dian)(dian)(dian)(dian)(dian)器(qi)(qi)網(wang)-cnelc]的(de)(de)(de)一些特色。SSI連(lian)接(jie)器(qi)(qi)是(shi)用于AC/DC電(dian)(dian)(dian)(dian)(dian)(dian)(dian)源(yuan)接(jie)口和(he)配電(dian)(dian)(dian)(dian)(dian)(dian)(dian)體系(xi)(xi)的(de)(de)(de)規(gui)范連(lian)接(jie)器(qi)(qi)。但是(shi)，一項新式的(de)(de)(de)、經(jing)強化的(de)(de)(de)電(dian)(dian)(dian)(dian)(dian)(dian)(dian)源(yuan)觸點(dian)規(gui)劃使得(de)單個電(dian)(dian)(dian)(dian)(dian)(dian)(dian)源(yuan)觸點(dian)在 30℃、零氣流(liu)量(liang)的(de)(de)(de)條(tiao)件(jian)下可取得(de)82A/℃觸點(dian)的(de)(de)(de)強度，一起稍(shao)微(wei)減小(xiao)電(dian)(dian)(dian)(dian)(dian)(dian)(dian)源(yuan)觸點(dian)中心線(xian)的(de)(de)(de)距離。關(guan)于高瓦(wa)數(shu)的(de)(de)(de)電(dian)(dian)(dian)(dian)(dian)(dian)(dian)源(yuan)、效勞(lao)器(qi)(qi)、存儲裝置、通訊設(she)備以及熱插(cha)撥冗余(yu)N+1配電(dian)(dian)(dian)(dian)(dian)(dian)(dian)體系(xi)(xi)來說，它(ta)是(shi)一種(zhong)理想的(de)(de)(de)連(lian)接(jie)器(qi)(qi)。此外，單個連(lian)接(jie)器(qi)(qi)上的(de)(de)(de)配電(dian)(dian)(dian)(dian)(dian)(dian)(dian)電(dian)(dian)(dian)(dian)(dian)(dian)(dian)源(yuan)觸點(dian)和(he)電(dian)(dian)(dian)(dian)(dian)(dian)(dian)源(yuan)操控(kong)信號(hao)觸點(dian)為體系(xi)(xi)規(gui)劃者(zhe)供給極大的(de)(de)(de)靈敏性。模塊式東西(xi)辦法便(bian)于高度自定義裝備，以滿意不(bu)同(tong)電(dian)(dian)(dian)(dian)(dian)(dian)(dian)源(yuan)運用的(de)(de)(de)需求。
背板(ban)(ban)到(dao)卡(ka)運(yun)(yun)(yun)用(yong)(yong)(yong)(yong)是(shi)向更高電(dian)(dian)源(yuan)密(mi)(mi)度開展的(de)另一(yi)(yi)個(ge)趨勢(例如，中(zhong)板(ban)(ban)到(dao)刀片(pian)或操控卡(ka)接口)。在(zai)高速運(yun)(yun)(yun)用(yong)(yong)(yong)(yong)中(zhong)，將功(gong)(gong)率(lv)輸出功(gong)(gong)用(yong)(yong)(yong)(yong)與信(xin)(xin)(xin)號(hao)連接器(qi)(qi)進行(xing)組合對(dui)錯(cuo)常有(you)益的(de)。在(zai)底板(ban)(ban)和(he)(he)正交中(zhong)板(ban)(ban)運(yun)(yun)(yun)用(yong)(yong)(yong)(yong)版別中(zhong)，運(yun)(yun)(yun)用(yong)(yong)(yong)(yong)無(wu)保護技能(neng)(用(yong)(yong)(yong)(yong)于(yu)增強信(xin)(xin)(xin)號(hao)密(mi)(mi)度)的(de)信(xin)(xin)(xin)號(hao)/電(dian)(dian)源(yuan)連接器(qi)(qi)是(shi)運(yun)(yun)(yun)用(yong)(yong)(yong)(yong)該項技能(neng)的(de)一(yi)(yi)種產(chan)品。在(zai)單個(ge)外殼內，這種高速度/高功(gong)(gong)率(lv)組合連接器(qi)(qi)可(ke)使信(xin)(xin)(xin)號(hao)和(he)(he)電(dian)(dian)源(yuan)“嵌件(jian)成型引線框安裝”(IMLA)在(zai)同一(yi)(yi)個(ge)連接器(qi)(qi)內混合，供給靈敏(min)的(de)管(guan)腳排列(lie)，使其在(zai)三(san)維空(kong)間上取得最大信(xin)(xin)(xin)號(hao)密(mi)(mi)度和(he)(he)電(dian)(dian)源(yuan)密(mi)(mi)度。此方案滿意了體(ti)系規劃者(zhe)針對(dui)單個(ge)可(ke)裝備產(chan)品有(you)關熱量、力學(xue)和(he)(he)高速方面的(de)要求，無(wu)須運(yun)(yun)(yun)用(yong)(yong)(yong)(yong)新東西或較(jiao)長研發周期。
AirMax VS 緊(jin)湊(cou)合算的電源(yuan)塊
即(ji)插即(ji)用(yong)功用(yong)
在某(mou)些(xie)(xie)背(bei)板到卡運用(yong)(yong)中，劇增的電(dian)源(yuan)需求導致(zhi)在高(gao)速(su)信(xin)號連(lian)(lian)(lian)接(jie)器(qi)(qi)(qi)毗(pi)(pi)連(lian)(lian)(lian)的當地運用(yong)(yong)單個獨立式(shi)電(dian)源(yuan)連(lian)(lian)(lian)接(jie)器(qi)(qi)(qi)。關(guan)于這些(xie)(xie)運用(yong)(yong)，模(mo)(mo)塊(kuai)(kuai)(kuai)化將用(yong)(yong)于高(gao)速(su)即(ji)插即(ji)用(yong)(yong)連(lian)(lian)(lian)接(jie)器(qi)(qi)(qi)、信(xin)號連(lian)(lian)(lian)接(jie)器(qi)(qi)(qi)、電(dian)源(yuan)連(lian)(lian)(lian)接(jie)器(qi)(qi)(qi)以及(ji)其他類型的連(lian)(lian)(lian)接(jie)器(qi)(qi)(qi)。連(lian)(lian)(lian)接(jie)器(qi)(qi)(qi)生產商(shang)規劃出疊(die)加式(shi)部件——電(dian)源(yuan)連(lian)(lian)(lian)接(jie)器(qi)(qi)(qi)，將其疊(die)加在其他背(bei)板到卡連(lian)(lian)(lian)接(jie)器(qi)(qi)(qi)的周圍，支持端(duan)對端(duan)疊(die)加式(shi)解(jie)決方案。這些(xie)(xie)產品為高(gao)速(su)模(mo)(mo)塊(kuai)(kuai)(kuai)和電(dian)源(yuan)模(mo)(mo)塊(kuai)(kuai)(kuai)沿著板卡邊緣(yuan)以彼此毗(pi)(pi)連(lian)(lian)(lian)的方式(shi)疊(die)加供給了(le)靈敏性。
更小更便攜的(de)終端產品
設備(bei)的(de)(de)外形(xing)在不(bu)斷地依照(zhao)既(ji)定的(de)(de)規(gui)矩變(bian)得(de)(de)越來越精約，終端(duan)產(chan)品(pin)(pin)則變(bian)得(de)(de)愈加(jia)(jia)(jia)細巧。部(bu)(bu)件(jian)(jian)生(sheng)(sheng)產(chan)商需求規(gui)劃出愈加(jia)(jia)(jia)緊(jin)湊(cou)細巧的(de)(de)封裝。但(dan)是，因為處理器(qi)、存儲器(qi)以(yi)及(ji)其他(ta)集(ji)成(cheng)電路的(de)(de)數量在體(ti)系內不(bu)斷添加(jia)(jia)(jia)，發生(sheng)(sheng)了更多的(de)(de)熱量，使得(de)(de)熱辦(ban)理在體(ti)系規(gui)劃中(zhong)變(bian)得(de)(de)非常(chang)重要。關于電源連接器(qi)生(sheng)(sheng)產(chan)商來說(shuo)，這(zhe)些要素帶來了許多獨一無二的(de)(de)應戰(zhan)。今天(tian)，咱(zan)們的(de)(de)方(fang)針是在滿意不(bu)斷添加(jia)(jia)(jia)的(de)(de)電源要求的(de)(de)一起供給愈加(jia)(jia)(jia)細巧的(de)(de)封裝。具(ju)有(you)更小高度(du)和寬(kuan)度(du)的(de)(de)部(bu)(bu)件(jian)(jian)不(bu)光(guang)可認為放(fang)置其他(ta)附加(jia)(jia)(jia)部(bu)(bu)件(jian)(jian)供給更多空間(jian)，還能(neng)夠帶來更佳的(de)(de)氣流。例如，用密布(bu)刀片式效(xiao)勞器(qi)代替數據(ju)中(zhong)心內機架式效(xiao)勞器(qi)，顯現(xian)了產(chan)品(pin)(pin)朝(chao)著更小尺度(du)開展的(de)(de)行業(ye)趨勢(shi)。運轉這(zhe)些愈加(jia)(jia)(jia)緊(jin)湊(cou)的(de)(de)體(ti)系需求更高的(de)(de)電源密度(du)和信號(hao)密度(du)。
HCI連接器
電源連接器生廠商需求(qiu)要點考慮電流密(mi)度、剖面高(gao)度和寬(kuan)度以及氣流，因為當處理器(qi)變得愈加高(gao)效且耗費更少電源時，單個(ge)體系內處理器(qi)數量的(de)添(tian)加會導致在用(yong)電量方(fang)面發生一個(ge)凈增(zeng)額。此外，更高(gao)的(de)機架(jia)密(mi)度和更高(gao)瓦數的(de)電能供應要求(qiu)具(ju)有更高(gao)電源密(mi)度的(de)連接器(qi)解決方(fang)案。
高電流運用(yong)
連接器生廠商(shang)在規范(fan)、高(gao)(gao)效、低成(cheng)(cheng)本的(de)(de)(de)沖壓成(cheng)(cheng)型電(dian)源(yuan)(yuan)(yuan)觸點(dian)基座上裝置具有高(gao)(gao)電(dian)源(yuan)(yuan)(yuan)密(mi)度(du)的(de)(de)(de)電(dian)源(yuan)(yuan)(yuan)連接器。沖壓成(cheng)(cheng)型技能使(shi)(shi)得獲(huo)取高(gao)(gao)電(dian)源(yuan)(yuan)(yuan)密(mi)度(du)成(cheng)(cheng)為(wei)可能。在高(gao)(gao)電(dian)流運(yun)用(yong)中，這種高(gao)(gao)效低成(cheng)(cheng)本的(de)(de)(de)技能能夠(gou)代替貴(gui)重(zhong)的(de)(de)(de)螺絲(si)機床觸點(dian)。而(er)高(gao)(gao)傳(chuan)導性銅合金(jin)的(de)(de)(de)摻入(ru)、優化的(de)(de)(de)電(dian)源(yuan)(yuan)(yuan)觸點(dian)規劃(hua)以(yi)及通(tong)風外(wai)殼提升(sheng)了(le)設備功用(yong)，使(shi)(shi)其符兼并超過現在高(gao)(gao)電(dian)流運(yun)用(yong)的(de)(de)(de)要求。
例(li)如，一家連(lian)接(jie)器(qi)(qi)供應(ying)商規(gui)劃出一種(zhong)新式電(dian)(dian)(dian)(dian)(dian)(dian)(dian)源(yuan)連(lian)接(jie)器(qi)(qi)體系(xi)(xi)，這種(zhong)體系(xi)(xi)包括現有(you)SSI連(lian)接(jie)器(qi)(qi)[工業電(dian)(dian)(dian)(dian)(dian)(dian)(dian)器(qi)(qi)網(wang)-cnelc]的(de)(de)(de)一些特色。SSI連(lian)接(jie)器(qi)(qi)是(shi)用于AC/DC電(dian)(dian)(dian)(dian)(dian)(dian)(dian)源(yuan)接(jie)口和(he)配電(dian)(dian)(dian)(dian)(dian)(dian)(dian)體系(xi)(xi)的(de)(de)(de)規(gui)范連(lian)接(jie)器(qi)(qi)。但是(shi)，一項新式的(de)(de)(de)、經(jing)強化的(de)(de)(de)電(dian)(dian)(dian)(dian)(dian)(dian)(dian)源(yuan)觸點(dian)規(gui)劃使得(de)單個電(dian)(dian)(dian)(dian)(dian)(dian)(dian)源(yuan)觸點(dian)在 30℃、零氣流(liu)量(liang)的(de)(de)(de)條(tiao)件(jian)下可取得(de)82A/℃觸點(dian)的(de)(de)(de)強度，一起稍(shao)微(wei)減小(xiao)電(dian)(dian)(dian)(dian)(dian)(dian)(dian)源(yuan)觸點(dian)中心線(xian)的(de)(de)(de)距離。關(guan)于高瓦(wa)數(shu)的(de)(de)(de)電(dian)(dian)(dian)(dian)(dian)(dian)(dian)源(yuan)、效勞(lao)器(qi)(qi)、存儲裝置、通訊設(she)備以及熱插(cha)撥冗余(yu)N+1配電(dian)(dian)(dian)(dian)(dian)(dian)(dian)體系(xi)(xi)來說，它(ta)是(shi)一種(zhong)理想的(de)(de)(de)連(lian)接(jie)器(qi)(qi)。此外，單個連(lian)接(jie)器(qi)(qi)上的(de)(de)(de)配電(dian)(dian)(dian)(dian)(dian)(dian)(dian)電(dian)(dian)(dian)(dian)(dian)(dian)(dian)源(yuan)觸點(dian)和(he)電(dian)(dian)(dian)(dian)(dian)(dian)(dian)源(yuan)操控(kong)信號(hao)觸點(dian)為體系(xi)(xi)規(gui)劃者(zhe)供給極大的(de)(de)(de)靈敏性。模塊式東西(xi)辦法便(bian)于高度自定義裝備，以滿意不(bu)同(tong)電(dian)(dian)(dian)(dian)(dian)(dian)(dian)源(yuan)運用的(de)(de)(de)需求。
背板(ban)(ban)到(dao)卡(ka)運(yun)(yun)(yun)用(yong)(yong)(yong)(yong)是(shi)向更高電(dian)(dian)源(yuan)密(mi)(mi)度開展的(de)另一(yi)(yi)個(ge)趨勢(例如，中(zhong)板(ban)(ban)到(dao)刀片(pian)或操控卡(ka)接口)。在(zai)高速運(yun)(yun)(yun)用(yong)(yong)(yong)(yong)中(zhong)，將功(gong)(gong)率(lv)輸出功(gong)(gong)用(yong)(yong)(yong)(yong)與信(xin)(xin)(xin)號(hao)連接器(qi)(qi)進行(xing)組合對(dui)錯(cuo)常有(you)益的(de)。在(zai)底板(ban)(ban)和(he)(he)正交中(zhong)板(ban)(ban)運(yun)(yun)(yun)用(yong)(yong)(yong)(yong)版別中(zhong)，運(yun)(yun)(yun)用(yong)(yong)(yong)(yong)無(wu)保護技能(neng)(用(yong)(yong)(yong)(yong)于(yu)增強信(xin)(xin)(xin)號(hao)密(mi)(mi)度)的(de)信(xin)(xin)(xin)號(hao)/電(dian)(dian)源(yuan)連接器(qi)(qi)是(shi)運(yun)(yun)(yun)用(yong)(yong)(yong)(yong)該項技能(neng)的(de)一(yi)(yi)種產(chan)品。在(zai)單個(ge)外殼內，這種高速度/高功(gong)(gong)率(lv)組合連接器(qi)(qi)可(ke)使信(xin)(xin)(xin)號(hao)和(he)(he)電(dian)(dian)源(yuan)“嵌件(jian)成型引線框安裝”(IMLA)在(zai)同一(yi)(yi)個(ge)連接器(qi)(qi)內混合，供給靈敏(min)的(de)管(guan)腳排列(lie)，使其在(zai)三(san)維空(kong)間上取得最大信(xin)(xin)(xin)號(hao)密(mi)(mi)度和(he)(he)電(dian)(dian)源(yuan)密(mi)(mi)度。此方案滿意了體(ti)系規劃者(zhe)針對(dui)單個(ge)可(ke)裝備產(chan)品有(you)關熱量、力學(xue)和(he)(he)高速方面的(de)要求，無(wu)須運(yun)(yun)(yun)用(yong)(yong)(yong)(yong)新東西或較(jiao)長研發周期。
AirMax VS 緊(jin)湊(cou)合算的電源(yuan)塊
即(ji)插即(ji)用(yong)功用(yong)
在某(mou)些(xie)(xie)背(bei)板到卡運用(yong)(yong)中，劇增的電(dian)源(yuan)需求導致(zhi)在高(gao)速(su)信(xin)號連(lian)(lian)(lian)接(jie)器(qi)(qi)(qi)毗(pi)(pi)連(lian)(lian)(lian)的當地運用(yong)(yong)單個獨立式(shi)電(dian)源(yuan)連(lian)(lian)(lian)接(jie)器(qi)(qi)(qi)。關(guan)于這些(xie)(xie)運用(yong)(yong)，模(mo)(mo)塊(kuai)(kuai)(kuai)化將用(yong)(yong)于高(gao)速(su)即(ji)插即(ji)用(yong)(yong)連(lian)(lian)(lian)接(jie)器(qi)(qi)(qi)、信(xin)號連(lian)(lian)(lian)接(jie)器(qi)(qi)(qi)、電(dian)源(yuan)連(lian)(lian)(lian)接(jie)器(qi)(qi)(qi)以及(ji)其他類型的連(lian)(lian)(lian)接(jie)器(qi)(qi)(qi)。連(lian)(lian)(lian)接(jie)器(qi)(qi)(qi)生產商(shang)規劃出疊(die)加式(shi)部件——電(dian)源(yuan)連(lian)(lian)(lian)接(jie)器(qi)(qi)(qi)，將其疊(die)加在其他背(bei)板到卡連(lian)(lian)(lian)接(jie)器(qi)(qi)(qi)的周圍，支持端(duan)對端(duan)疊(die)加式(shi)解(jie)決方案。這些(xie)(xie)產品為高(gao)速(su)模(mo)(mo)塊(kuai)(kuai)(kuai)和電(dian)源(yuan)模(mo)(mo)塊(kuai)(kuai)(kuai)沿著板卡邊緣(yuan)以彼此毗(pi)(pi)連(lian)(lian)(lian)的方式(shi)疊(die)加供給了(le)靈敏性。
